Argos – High Throughput Macro Inspection:
MueTec's High Throughput Macro Defect Inspection products are designed for customers with many different wafer types that intend to replace manual inspection. The system is easy to operate and does not require to write any recipes. It also enables 100% inspection of all wafer during the process of lithography with a throughput that is equal to, or faster that of a lithography cluster. In consequence, we enable our customers to move from sample inspection to inspection of all wafer and from manual inspection by operators to a statistically reliable, automated inspection process. Our tools can easily be setup without using much floor space. Low acquisition and operating costs guarantee a fast return on invest.
Argos 150, Argos 200
200mm Wafer Macro Defect InspectionShow details
Key Features:
Simultaneous bright- and darkfield front and backside inspection
Unique, optimized wafer handling for a throughput 200 wafer per hour
No recipe required for ease of use:
Enables productivity gains through minimum recipe customization
Ideal for fabs and packaging areas with many different devices & die sizes
No knowledge about geometry and physical parameters needed
Die layout data is not necessary
Recognition of active die area and EBR zone
Different sensitivities for different wafer areas
Avoiding false positives at zone transitions
Automatic adjustment of light intensity
Reflectivity of inspected layer is not necessary
Automatic defect recognition parameters by adaptive software algorithm
Simulaneous wafer frontside and backside inspection
Highly cost effective solution for fast return on invest
Patented wafer alignment
Data aquisition perfectly balanced to mechanical movements
Argos 300
200mm/300mm Wafer Macro Defect InspectionShow details
Key Features
300 mm FOUP based handling
Data acquisition perfectly balanced to mechanical movements
Simultaneous bright- and darkfield front and backside inspection
Modular design with 1 – 3 process chambers, depending on throughput requirements
No recipe required for ease of use:
Enables productivity gains through minimum recipe customization
Ideal for fabs and packaging areas with many different devices & die sizes
No knowledge about geometry and physical parameters needed
Die layout data is not necessary
Recognition of active die area and EBR zone
Different sensitivities for different wafer areas
Avoiding false positives at zone transitions
Automatic adjustment of light intensity
Reflectivity of inspected layer is not necessary
Automatic defect recognition parameters by adaptive software algorithm
Argos 300-F
Post-saw Framed Wafer InspectionShow details
The Argos 300-F product is optimized for post-saw inspection of framed wafer on foil. With a high throughput of 110 300mm wafer on a 380mm frame, the system inspects many different defect types, from sawing line failures to defects on the foil and on the frame.
Key Features:
380 mm framed wafer FOUP based handling
Optimized for multi-zone inspection of wafer, foil and frame.
Data acquisition perfectly balanced to mechanical movements
Simultaneous brightfield and dark field inspection
No recipe required for ease of use
Rembrandt – High Resolution Macro Inspection:
While the Argos products are designed for high throughput at lower resolutions, the Rembrandt products are designed for high resolution macro defect inspection from 1μm to 4μm in optical resolution.
Rembrandt 200 / 300
200mm MEMS inspection and metrology system (SMIF)Show details
Typical Applications
Macro defect inspection of 200mm and 300mm wafer
Features
200mm SMIF or 300 mm FOUP based handling
Data acquisition perfectly balanced to mechanical movements
Illumination: Bright and darkfield, LED based
Black/white and colored image of sample
Modular system architecture results in small footprint
Design allows addition of 3rd module and 4th FOUP
Throughput optimized & balanced system integration avoids bottlenecks
Spector – Mask Defect Inspection:
The Spector series offers defect inspection of masks with or without pellicle.
Spector
Automatic and fully enclosed with FFUShow details
Typical Application
Mask defect inspection
Key Features
Fully enclosed tool architecture
Robot handling of masks with up to 2 pod or cassette stations
Automatic inspection based on die-to-die comparison
Resolution of 0,5 μ/pixel
Defect sizes as of 1 μm
Mask sizes up to 14’’
Spector A
Automatic with mask robot and mask carriersShow details
Typical Application
Mask defect inspection
Features
Open tool architecture
Robotor mask loading and unloading
Fully automatic mask inspection
Automatic inspection based on die-to-die comparison
Resolution as of 0,5 μ/pixel
Defect sizes as of 1 μm
Mask sizes up to 14’’
Spector M
Semi AutomaticShow details
Typical Application
Mask defect inspection
Features
Open tool architecture
Manual operator mask loading and unloading
Automatic inspection based on die-to-die comparison
Resolution as of 0,5 μ/pixel
Defect sizes as of 1 μm
Mask sizes up to 14’’