MT 2010
MT technology
The MT systems are the first generation of metrology and inspection tools and based on an open frame design for high flexibility and accessibility. Tool application field varies from metrology and inspection in light range from UV, visible and infrared. The tools are available in semi-automated version, typically used in semiconductor development area as well as fully automated version for production area. With the special infrared version we enable the customer to inspect silicon or GaAs wafers and other substrates with respect to sealing and device defects.
Used in:
semiconductor manufacturing - Front-END
Key differences:
Open frame tool; semi-automated for wafer sizes up to 200mm
Key Features:
Metrology (overlay, critical dimension) with visible illumination; film thickness measurement
Product highlights
- semi-automatic
- typical application: wafer metrology
- open tool architecture
- manual operator wafer loading and unloading
- automatic inspection based on die-to-die comparison
- repeatability from overlay measurement down to 4nm
- repeatability from critical dimension (CD) measurement down to 5nm
- wafer size up to 8 inch
Your contacts
Arne Holland
Head of Sales, Service and Applications
