ARGOS 200-F SiC
ARGOS technology
The ARGOS system for macro defect inspection is easy to operate and does not require to write any recipes. It also enables 100% inspection of all wafer during the process of lithography with a throughput that is equal to, or faster that of a lithography cluster. In consequence, we enable our customers to move from sample inspection to inspection of all wafer and from manual inspection by operators to a statistically reliable, automated inspection process.
Used in:
Semiconductor manufacturing - BACK-END
Key differences:
Closed Frame Tool; F=Frame; SiC = Silicon Carbide Technology;
Key Features:
Macro Defect Inspection; Optimized for SiC material;
Product highlights
- fully automated inspection system
- closed tool architecture
- robot-based and manual wafer loading possible
- typical application: post-saw framed wafer inspection, optimised for SiC based substrates
- multi-zone inspection of wafer, foil and frame
- SECS/GEM interface - fully remote host control
- simultaneous bright and dark field inspection
- 200mm silicon carbide framed wafer
- dual arm robot handling with wafer mapper
- recipe less operation
- full field backside inspection
Your contacts
Arne Holland
Head of Sales, Service and Applications
