ARGOS 200 / 300
ARGOS technology
The ARGOS system for Macro defect inspection is easy to operate and does not require to write any recipes. It also enables 100% inspection of all wafer during the process of lithography with a throughput that is equal to, or faster that of a lithography cluster. In consequence, we enable our customers to move from sample inspection to inspection of all wafer and from manual inspection by operators to a statistically reliable, automated inspection process.
Used in:
Semiconductor manufacturing - Front-END (Lithography)
Key differences:
Closed frame tool; 200 or 300 mm Wafer
Key Features:
Macro Defect Inspection; FOUP based handling
Product highlights
- fully automated inspection system
- closed tool architecture
- robot-based and manual wafer loading possible
- typical application: wafer macro defect inspection
- recording from different defect types such as particles, scratches, resist residue, mask defects
- SECS/GEM interface - fully remote host control
- simultaneous bright and dark field inspection
- 200mm / 300mm wafer
- dual arm robot handling with wafer mapper
- recipe less operation
- full field backside inspection
Your contacts
Arne Holland
Head of Sales, Service and Applications
