ARGOS 150HT / 200HT
ARGOS technology
The ARGOS system for macro defect inspection is easy to operate and does not require to write any recipes. It also enables 100% inspection of all wafer during the process of lithography with a throughput that is equal to, or faster that of a lithography cluster. In consequence, we enable our customers to move from sample inspection to inspection of all wafer and from manual inspection by operators to a statistically reliable, automated inspection process.
Used in:
Semiconductor manufacturing - Front-END(Lithography)
Key differences:
Closed Frame Tool; HT = high throughput
Key Features:
Simultaneous wafer handling from 2 open cassette ports for high throughput; small footprint; recipeless operation
Product highlights
- fully automated inspection system
- closed tool architecture
- robot-based and manual wafer loading possible
- typical application: wafer macro defect inspection
- recording from different defect types such as particles, scratches, resist residue, mask defects
- SECS/GEM interface - fully remote host control
- simultaneous bright and dark field inspection
- 150mm / 200mm wafer
- recipe less operation
- full field front- and backside inspection
- optimised for high throughput
- small footprint design
Your contacts
Arne Holland
Head of Sales, Service and Applications
