The Film Thickness (FT) module measures the thickness of optically transparent films and is optionally available for MT2010/MT3000. FT measurements are based on the evaluation of the light spectrum of a laser beam that is reflected on the film layer boundaries. This method can measure single, double, and even triple transparent layers on non-transparent substrates. A variable laser spot size allows for targeted measurements in the active area of integrated circuits.
Basic principle behind measuring film thickness
A comparison of spectral analysis of the reflected light intensity, once measured with and once without the layer of unknown thickness. Non-polarized white light incident perpendicularly to the surface is applied. The resulting spectra depend on the materials of the substrate and the film as well as on the thickness of the layer. The spectral evaluation is performed fully automatically applying complex mathematical algorithms incorporated in the MT2010/MT3000 software.
Depending on the film thickness two different methods can be used: either FFT or FIT.
- Thick films are evaluated applying the FFT method.
- Thin and multiple films are measured using FIT.
- The FIT method can measure up to three layers simultaneously
Measuring thickness with the FIT method
FIT finds the best match between the measured spectrum and a theoretical model spectrum The model parameters then reveal the layer thickness. The model parameters can deal with up to three different layers.
The following figure shows a measured reflectance spectrum of a film with two layers in blue and the calculated best-fit model spectrum in red.
Blue: measured reflectance spectrum of a two layered film.
Red: the calculated best-fit model spectrum
Measuring thickness with the FFT method
FFT calculates the thickness by searching for periodic structures (minima and maxima) in the reflectance spectrum. In combination with the optical properties of the film, FFT calculates the film thickness from the frequency of the most regular and of the strongest periodic signal
In the MT2010/MT3000 software a user-interface window displays the frequency spectrum (highest peak corresponds to the most prominent frequency signal) and the calculated result as seen below:
The FFT frequency spectrum of a substrate reflectance spectrum
The optional MueTec FT measurement application provides the customer with the flexibility that allows reliable film thickness measurements of thickness ranges from 40 micron down to 10nm.
Argos 300
200mm/300mm Wafer Macro Defect InspectionShow details
Key Features
300 mm FOUP based handling
Data acquisition perfectly balanced to mechanical movements
Simultaneous bright- and darkfield front and backside inspection
Modular design with 1 – 3 process chambers, depending on throughput requirements
No recipe required for ease of use:
Enables productivity gains through minimum recipe customization
Ideal for fabs and packaging areas with many different devices & die sizes
No knowledge about geometry and physical parameters needed
Die layout data is not necessary
Recognition of active die area and EBR zone
Different sensitivities for different wafer areas
Avoiding false positives at zone transitions
Automatic adjustment of light intensity
Reflectivity of inspected layer is not necessary
Automatic defect recognition parameters by adaptive software algorithm
MT2010
Fully automated metrology and inspection system (open cassette)Show details
The MT2010 is designed for high precision defect inspection and metrology tasks on masks up to 6”. The system uses different illumination sources in transmitted and reflected light such as visible, I-line (365nm) and DUV (248nm).
MT2010 comes with laser autofocus and an anti-vibration isolating base frame with light tower.
MT3000
Fully automated metrology and inspection system (open cassette)Show details
Typical Applications
CD
Overlay
Film Thickness
Defect Inspection
Defect Review
Features
VIS, UV
Simultaneous wafer handling 75 - 200mm
SECS/GEM