DaVinci 200IR / 300IR
DaVinci technology
The DaVinci infrared (IR) system is optimized for IR inspection and provide the same high precision overlay and critical dimensions (CD) measurement as other DaVinci systems. The IR option offers the customer a sealing and device inspection after bonding and can be used to increase the manufacturing yield, especially in MEMS production area. We provide fully automated solutions for 200 mm and 300 mm wafer types, independet of the doping level of the wafer.
Used in:
semiconductor manufacturing - Front-END
Key differences:
Closed Frame Tool; Fully automated infrared tool for wafer sizes up to 300 mm
Key Features:
Metrology (Critical Dimension and overlay) for wafer; Visible and infrared Illumination; for mems wafer with high doping levels
Product highlights
- fully automated metrology system
- closed tool architecture
- robot-based and manual wafer loading possible
- typical application: sealing inspection after bonding (eutectic bonding or glass frit bonding) for MEMS specific wafers
- overlay and critical dimension (CD) measurement after bonding
- SECS/GEM interface - fully remote host control
- combined reflected & transmitted light illumination modes
- 200mm / 300mm wafer
- dual arm robot handling with wafer mapper
- best IR image quality with wavelength up to 1500nm
Your contacts
Arne Holland
Head of Sales, Service and Applications