MueTec has developed a SDI (Smart Defect Inspection) method which eliminates all disadvantages of the Inspection using the Golden Image principle. If your substrates extremely change regarding structure size, contrast and color from wafer to wafer or chip to chip this method will take care your demands. Please ask for more information.
MueTec inspection supports also the Golden Image principle where images of various substrates are compared with a “golden” pre-produced template image to identify defects for subsequent analysis and classification.
MueTec has a long-standing experience in providing customized soft- and hardware solutions for in-situ defect identification on regular or irregular structures, employing advanced pattern recognition, object analysis, object modelling, and object filtering algorithms. A significant advantage of all MueTec solutions is the fact, that also existing MueTec tools are expandable for Defect Inspection purposes. Mostly it is only a question of software extension, leading to reasonably Cost of Ownership.
