MueTec provides film thickness measurement solutions to measure transparent layers. All tools are microscope based and enable measurements in optically controlled areas with low expansions.
A specific advantage of MueTec’s problem solutions is the fact that a film thickness measurement device can be integrated in a system able to measure also CDs and overlay registration.
MueTec customers like especially the opportunity and the advantages of combining different other investigation possibilities (like CD and Overlay measurements) with film thickness measurements.
The film thickness measurement device is fully included in the microscope’s design.
Regarding measurements on wafers does this mean that a wafer has only once to be transported for at least two different investigations.
MueTec’s combination enhances security for the wafers, enhances throughput, and lowers tool’s cost-of-ownership.
Enabled is the method combination by several exits of the microscope’s beam path.
The film thickness unit can mesure 1 - 3 Layers from 10nm - 40 micron.