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- MueTec 3000 offers the capability to automatically measure up to 3 cassettes of wafers.
- MueTec 3000 includes an automation package including a robotic wafer handler with integrated prealigner and motorized XYZ scanning stage.
- MueTec 3000 can automatically load wafers, detect barcodes, detect alignment and measurement features and automatically perform measurements without operator assistance.
- MueTec 3000 is qualified to measure wafers with very low contrast appearing in manufacturing processes like STI (shallow trench isolation) and CMP (chemical mechanical polishing) using specially developed filters. A double antivibration isolation table is standard. The NanoStar software supports a Job Wizard which allows easy, fast, and flexible job teaching. UV-light, film thickness measurement , Barcode reader, and SECS GEM are available optionally. Our customers especially prefer the combination of Critical Dimensions (CD), overlay, and film thickness measurement with incoming mask measurement and inspection.
- MueTec 3000 tool is featuring NONSTOP operation where operators only have to place cassettes onto the system. MueTec 3000 recognizes new cassettes on the system, wafers are selected randomly, job dependent, or by factory host, and automatically loaded to the Barcode Reader. The factory host selects the job depending on the barcode via SECS GEM. During the measurement of one wafer the next wafer is prepared by the robot in parallel. Complete operation is NONSTOP.
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Specifications:
| Overlay Measurements | | Dynamic Precision | Etched wafers
Resist wafers
Tool induced Shift | | ≤ 2nm 3σ
≤ 4nm 3σ
≤ 3nm 3σ | | | | | CD Measurements | Etched wafers
Resist wafers | | ≤ 4nm 3σ
≤ 9nm 3σ | | | | | Throughput | | 5 Measurements | All wafers from a lot
Single wafer | | ≥ 70 wafers/h
≤ 70 sec | | | | | Reliablility, Availability, and Maintainability (RAM) | Uptime
MTBF
MTBA
MTTR | | ≥ 95%
≥ 1800h
≥ 160h
≤ 4h | | | | | Cleanroom class | | 1 compatible | | | |
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