MueTec 50/100 (Leica LWM 100)

MueTec 100 Leica LWM 100

Metrology tool for automatic measurement of single substrates

Mask	Wafer	MEMS

CD	Overlay	FT	I&R	DI

x = included. [x] = optional.
CD = Critical Dimension (Linewidth Measurement),
FT = Film Thickness, I&R = Inspection & Review, DI = Defect Inspection



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Unique Hardware Features

The MueTec 100 offers the capability to automatically measure Critical Dimensions (CD) of single substrates such as masks, wafers, MEMS and others.
By adding a motorized XY- stage and pattern recognition software, the MueTec 100 tool can easily be programmed to detect and measure features automatically with minimal operator assistance. The system is equipped with the MueTec NanoStar software which permits easy and fast measurement setups, data statistics, and image enhancement, and includes a huge measurement package. This model is also optionally available with overlay registration and film thickness measurement software, UV illumination, and vibration isolation table.

Specifications:

Dynamic Precision: CD Measurements
Masks Wafers		≤ 5nm 3σ ≤ 10nm 3σ

Dynamic Precision: Film Thickness Measurements
Oxide, Nitride Resist layers		≤ 1nm 3σ ≤ 3nm 3σ

Dynamic Precision: Overlay Measurements
Etched wafers Resist on metal Toll included shift		≤ 5nm 3σ ≤ 8nm 3σ ≤ 8nm 3σ

Reliability, Availability and Maintainability (RAM)
Uptime MTBF MTBA MTTR		≥ 95% ≥ 1800h ≥ 160h ≤ 4h

Cleanroom class
1 compatible