Wafer Overview
MueTec wafer tools combine linewidth (CD critical dimension) measurements, overlay registration, and film thickness measurements.


MueTec 50
Semi-automatic measurement of masks, wafer and MEMS. Antivibration base frame is optionally available. MueTec 50 can be upgraded to MueTec 100.

MueTec 100 Leica LWM 100
Fully automatic measurement of masks, wafer and MEMS. Antivibration base frame is optionally available. MueTec 100 can be upgraded to MueTec 2000.

MueTec 2000
Fully automatic measurement of masks, wafers and MEMS. Antivibration base frame and rack for media controller and PCs included. System is designed for ultra high precision measurements.

MueTec 3000 Leica LWS 3000
CD/Overlay/Film Thickness tool for fully automatic measurement of 3 cassettes of wafers and MEMS. Automation package with robotic handling system included. Features NONSTOP operation. Antivibration base frame and rack for media controller and PCs included. System is designed for ultra high precision measurements.





MueTec is cooperating successfully with Vistec Semiconductor Systems GmbH (formerly Leica Microsystems Semiconductor) in this field since 1995. Since 2001 MueTec also uses Leica DUV optics in a microscope platform, invented by MueTec and offering highest mechanical stability and Z-resolution for metrology.

Copyright © 2008 MueTec GmbH. All rights reserved.