The MueTec 2000 offers the capability to automatically measure Critical Dimensions (CD) of single substrates such as masks, wafers, MEMS and others. The automation package contains a motorized XY stage and pattern recognition software. The tool can easily be programmed to detect and measure features automatically with minimal operator assistance. The system is equipped with the MueTec NanoStar software which permits easy and fast measurement setups, data statistics, image enhancement, and includes a huge measurement package. This model is also optionally available with UV illumination, overlay registration and film thickness measurement software.

Throughput
≤ 1 sec per image
Lowest defect size
≤ 0.5 x 0.5 micron (150x objective) ≤ 2 x 2 micron (50x objective)
Reliability, Availability and Maintainability (RAM)
Uptime MTBF MTBA MTTR		≥ 95% ≥ 1800h ≥ 160h ≤ 4h
Clean room class
1 compatible

Final specifications will be agreed by customer
and MueTec using mutally accepted wafers