Wafer Level Packaging
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where many IC's can be stacked together using suitable interconnect processes (like TSV or metal bumps) followed by encapsulation.
- CD Measurement, Overlay and Defect Inspection and Review very similar to the classical IC manuafturing process are used.
- Due to the three dimensional character of many MEMS devices we have developed a Infrared Inspection & Measurement tool with which we can investigate layer per layer.